Cracks

Intel Cracks The Encapsulation Wall Blocking Hyper-Large Chips, Pushing Advanced Packaging To 24x Reticle Size and Beyond

Intel has overcome one big challenge that will lead to the creation of hyper-large chips beyond 12x reticle size through advanced packaging technologies. Intel Is Creating The World's Most Advanced & Largest Chips in the US at Its New Mexico "Rio Rancho" Facility, Leveraging Next…

Nintendo Doubles Down on Switch 2 Security, But Developer Gezine Cracks a Universal Exploit That Works Entirely Offline

While Nintendo continues to double down on the Switch 2 security with consistent firmware updates, the modding scene for the current-generation system by the Japanese company has hit a significant milestone earlier this month, as developer Gezine has uncovered a userland exploit…